Press Release: TSMC Accelerates U.S. Expansion with $100 Billion Investment
Taiwan Semiconductor Manufacturing Company (TSMC) is significantly ramping up its U.S. operations with a landmark $100 billion investment aimed at establishing three semiconductor fabrication plants, two advanced packaging facilities, and a research and development center. Sources indicate that the precise locations for the advanced packaging plants remain undetermined, with TSMC reviewing potential sites.
Currently, TSMC owns approximately 1,100 acres in Arizona for six fabs, but the advanced packaging plants and R&D center may necessitate separate locations. In January, NVIDIA began production of its 4nm chips at TSMC’s Arizona site, although these chips must be returned to Taiwan for advanced packaging due to the lack of U.S. capacity.
Establishing advanced packaging facilities is expected to pose challenges, potentially taking up to four years due to the need for specific infrastructure, including metal bumping technology. TSMC aims to address rising demand from clients like Apple, NVIDIA, and AMD with initial U.S.-based production of CoWoS and InFO lines.
Trial production for TSMC’s Fab 21 Phase 2 facility is targeted for late 2026, with plans for a CoWoS-enabled packaging facility to follow.
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